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Electrical/Electronic Design |
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Wiring schedules are produced using Excel spreadsheets and Elma-Mektron has a standard format that many of our customers use to supply project specific I/O wiring information. This allows a simple cut and paste into the project wiring schedules thus minimising time and errors for our customers. Our designs use a variety of interconnection methods; e.g. we have developed specific VME and CompactPCI I/O connector PCB’s, which we call paddle cards. These typically connect P2 and P0 connections for VME, and P3, P4 and P5 connectors for CompactPCI, to external MIL circular connectors to provide a rugged, multi-way, polarised external I/O interface. Internally, flexi circuits, ribbon cables, screened cables etc are used, dependant upon the project requirements. Typical systems design includes backplanes, PSUs, thermal management, peripheral devices and wiring I/O, and in many cases customer specific control or monitoring PCBs. Elma-Mektron uses a range of commercially available backplanes, and for many applications these are entirely suitable. However, there are some designs that require a custom backplane, consequently Elma-Mektron has developed a range of rugged backplanes the designs of which form the basis of our custom designs where customer specific I/O tracking can be added, additional I/O connectors added, or other features integrated onto the board. This range is being added to all the time. With over 1000 completed designs, the number and complexity of PSU configurations is considerable. We have developed specific solutions for a number of applications, these include multiple hot swap PSUs, blind mate PSU shuttles, N+1 redundant PSUs, a range of interface cards for Vicor modular brick PSU elements as well as fault and diagnostic schemes. Thermal management is always a key design task, and Elma-Mektron has created a number of both standard and novel approaches to thermal management. These include control and monitoring as well as alarm hardware. The Climatic Control Module enables the use of commercial electronic hardware in otherwise extreme temperature environments. We make extensive use of design calculators to review different thermal options at design concept stages. Many applications require the use of peripheral devices and mass storage devices within the chassis, these may be fixed or removable, sometimes they need to be place behind a lockable EMC door. Designs completed include RAID configurations and a variety of mass storage devices fitted into shuttles or individually fixed into the chassis. Elma-Mektron is often asked to provide a higher level of integration, this can include the fitting and testing of free issue boards and basic exercising of the system hardware. Our qualified team of design and test engineers is able to discuss and develop in conjunction with the customer test plans and procedures, should this be required. Accordingly, every systems solution is designed from the outset in accordance
with proven good EMC practice which forms an integral part of the design
process. Elma-Mektron has it’s own high investment pre-compliance
test facility which is backed by a consultancy service that assures a
pro-active and constructive approach to EMC conformity. Our EMC test chamber
provides a proving ground for new designs and thus enables the highest
standards of EMI shielding to be met.
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