High Integrity Frame

DESIGN INTEGRITY

USEFUL DESIGN DATA

PROBLEM SOLVING INNOVATIONS

Innovations Overview

Crush Fold Technology

High Integrity Frame

Heat Exchanger

I/O Interfacing

Dock, Mate & Lock

Lightweight Carbon Fibre

Conduction cooled enclosures are generally associated with expensive manufacturing techniques as they are often designed in a way that does not easily accommodate change or practical scalability. Conventional methods of this type of manufacture can include wire erosion from a solid block, casting or bolted/dip braised machined sections.

Elma-Mektron’s tried and tested ‘High Integrity Frame’ technology (Patent File No. 9906082.4) overcomes all of these complexities without compromising thermal efficiency or structural strength. Elma-Mektron’s revolutionary approach involves the use of a modular, high tensile strength skeletal frame which is precision-machined from aluminium and consists of a number of interlocking sections that incorporate EMC and hermetic gasket channels. The assembled frame is held together with locking dowel pins. Special outer panels with an aerodynamically profiled surface are then fixed to the frame.

The frame construction offers an adaptable technique allowing full customisation of the size. A recess in the frame allows for EMC and hermetic sealing of the machined outer surfaces. These too can be designed with I/O apertures or cross milled for cooling purposes. Removal of the outer panels allows excellent access to the internal equipment for manufacturing or maintenance purposes.

This innovative technology combines low mass, excellent thermal efficiency and inherently high levels of manufacturing flexibility with significant cost benefits and reduced lead times.


Mektron's 'High Integrity Frame' construction technique	'High Integrity Frame' showing interlocking sections

Tel: +44 (0)1234 838822

Fax: +44 (0)1234 836650

Email: info@elma-mektron.co.uk